Performance Optimization of Cold Plate with Mixed Proportion of Ethylene Glycol in Water using CFD analysis

Abstract

The exponential growth of electronics and their use commercially combined with the need for better
power dissipation and system cooling, has caused the need to come up with better cooling technologies at
affordable costs that are viable for commercial packing. It is largely focused on high heat flux removal
from computer chips in the recent years. However, the equally important field of high-power electronic devices has
been experiencing a major paradigm shift from air cooling to liquid cooling over the last decade. A detailed study
about cold plate and its working under various parameters is studied. The modification is done in design of cold
plate to reduce its cost and also to increase the heat dissipation rate. Air-cooling is still the preferred method of
cooling electronic systems and especially in terms of cost. Air cooling, however, is starting to reach its limits for
some of the higher end electronic systems and as such there is a need to investigate the application of liquid
cooling for cooling high end servers. Also, it has been proved that airflow through circuit boards have
inherently low heat transfer coefficients and large pressure drops, and hence requires large heat transfer
areas with considerable amount of flow sections. The modified cold plate can use water with mixed percentage of
ethylene glycol solution to remove major part of heat produced and air for minor part by natural or forced
convection.